General purpose 1-part adhesive where high strength bonds are needed at temperatures up from -67º to 121ºC. Non-sag product. Typical substrates: Metals and Glass.
Initial cure: about 40 min. Available too in High-Dense & High-Temp versions.
- Extreme de-aeration for very dense void free bond lines
- One part, 100% solids, heat curing adhesive
- Pliable paste consistency goes where needed with no sagging
- Higher temperature resistance than two-part epoxy adhesives
- Flammability testing per UL94 HB
- This is the regular version of 2214